• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    When treating a semiconductor wafer (8), a treatment medium, in particular an etching or cleaning liquid from a nozzle (11) is applied to the semiconductor wafer (8). In this case, the temperature, the concentration and / or the amount of medium applied in the time unit are regulated as a function of the location (7) in which the medium is applied to the semiconductor wafer (8). Thus, uniform treatment of the semiconductor wafer (8) is achieved since nonuniformities in the semiconductor wafer (8) can be compensated.
    公开号:AT515147A1
    申请号:T946/2013
    申请日:2013-12-09
    公开日:2015-06-15
    发明作者:Jörg Ing Hofer-Moser；Manuel Linder
    申请人:4Tex Gmbh；
    IPC主号:
    专利说明:

    The invention relates to a method of treating objects with a liquid, and. Furthermore, a device with which the method according to the invention can be carried out.
    When treating objects with a liquid, there is a problem that the temperature, honsentration, and / or the amount of liquid applied to the surface of the article to be treated are changed depending on the prevailing circumstances. In doing so, it may be necessary to change the temperature, the concentration and / or the amount of liquid during dosages of the surface of the object, in order to change them accordingly to the tone of the bowl and / or the structure of the object.
    This problem arises, for example, in the etching of semiconductor wafers and in the cleaning of non-etched semiconductor gafters
    The biting of semiconductor gafes to mezzanines (Jitsfiüssi'gkoiten) is usually carried out by applying an etching medium to the semiconductor dafer, which is disordered on a support and rotated by the support.
    The currently used facilities for. Etching semiconductor wafers are too slow to control the temperature of the liquid to quickly change or quickly degrade the temperature during the process.
    It is exclusively possible to keep the temperature of the fluid steady by means of inert devices used in the prior art. An active influence on the uniformity of the temperature is not possible in the prior art. As a result, there is no uniform distribution of temperature on the half-board dafer, which deteriorates the uniformity of the result of the etching.
    Walter's problem is that in the current state of the art: at the beginning of the process (switch-on, on the surface to be treated) of the article {Ha.Ibleiter ~ Wa.fer} is brought to a colder than that for renewed, proper Machining aisle is required.
    First, do some riding, all mediator parts are in thermal equilibrium,
    The invention is based on the object, a method and a sum exports of the method suitable device ahead a lay, with the mehrend of the hands ins of the object (s, B, Wafer.) The temperature and / or Kon a ration and / or the amount of liquid can be arbitrarily changed to reflect differences in the structure of the object to be treated, in particular differences in brightness, in the surface e ine s. Ha 1 bleit e r: -Wafer: s, a u s :: u.g.Ieichen,
    Solved, nxrd dense object of the invention: with a method having the features of claim 1., As far as the device is concerned, the underlying object of the invention is achieved with a device, the features of the independent, directed to the device An spru. chs au fweis t.
    Preferred and advantageous embodiments of the invention are subject of the dependent claims,
    By the method according to the invention, it is achieved in its Ausfilhrungstormcn that the .Gleichmäßigkeit the result of the treatment dos Gogeustand.es, in particular the uniformity over the surface of the Haableirer-beetle is improved because it is possible, the temperature and ./oder Conception and / or adjust the amount of treatment agent applied to the article, Sb results in a reduction of rejects since an increase in quality is achieved.
    Furthermore, the invention allows for advantageously treating smaller structures.
    Furthermore, the process according to the invention eliminates a constant working-up of the liquid to the required temperature, so that energy can be released eixxgsspart »
    In one embodiment of the invention, inductive fragrance of the medium (liquid used to treat the article opens up the possibility of using small heating elements, so that temperature-controlling masses are reduced, by means of which a change occurs only at the surface of the material Thus, heat can be transferred by convection. This results in a rapid response to changes in the temperature of the medium required by the process.
    Since the tum. Treated medium (liquid, if necessary, must be cooled) Can be used with a clincher working with Peltier elements for example These Peltier elements can be used both hot and cooling, thus improving the dynamics of the process and device is.
    Furthermore, the invention allows, in the form of a flow regulator, the amount of medium (liquid, tu) which regulates the amount of medium (liquid; tu) present in the plastic material, in particular the nozzle Small: Flow heat the medium over a longer side space and heat the medium over a shorter period of time at a high flow rate by coupling these principles with the local location of the applicator, in particular its nozzle, relative to the indexxi object gives you a vorteilhalx te
    Operation birr: Treatment of objects with a medium of its liquid;), in particular when abbessing and / or cleaning: Häibleiter "- 'et al. Thus, in the invention, the invention forms a temperament manipulation of medium carried on the surface of the object; Liquid), wherein the medium can be heated or cooled.
    By regulating the flow rate of the fluid (f) carried on the fluid to be treated, especially at. naioseitar-Brnsniagen, gives an additional possible manipulation, in order to adapt aio V'erfahrbedingungen to the; 3.e.ge.b: enhe.i.t..eh.
    Preferably, in the context of the invention, the buf heating of the medium used for the treatment (liquid) by convective heat transfer of an induced by induction b.rvdärrntan, ceviisch cited inert.,. Surface, - the front; the medium (liquid. For the Ban and ment) dm is flowing. In particular, the use of a means of heating in the form of a flow sequence is preferred, since the transmission is predominantly by convection instead of jam or heat radiation. This results in a particularly effective heat transfer, which allows rapid heating of the medium of the liquid used for the treatment.
    In the method according to the invention, heating, cooling and regulating the flow rate are carried out by means which are conveyed to the line for guiding the handling medium to the burner only, in the presence of which it is harmful. Further details and features of the invention will become apparent from the detailed description of the preferred embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS, BRIEF DESCRIPTION OF THE PREFERRED EMBODIMENT OF THE INVENTION n there, dig. 2 on average a temperature sensor, which can scarcely detect the temperature in the area of the outer annealer direction, heg. 2 dan tempera ture sensor in divergent
    Darsceilarg, i "in step, another form of a temp. r - San s.o r s, arrange r scnemazu.scn .Connect erne device do heating of the liquid, joining, 6 one-tieriΐ of the device non erg, 5,
    Tig. 1 shows a further detail of the device 5, dig * 8 the device: of FIG. 5 in front of a scnfnsnsioht, partially cut, dig in section a device for cooling dig. Fig. 10 shows a device for controlling the flow rate and dig, Fig. 11 An arrangement for manipulating, the flow rate, a modified device embodiment of a device according to the invention and dig, 13 combination ion non-devices, the erfinäungsgamäßen
    Contraption.
    A device 1 according to the invention shown in Fig. 1 and suitable for carrying out the method of the invention comprises a carrier 19: f'-eteck "on which a Baibieiter® Waier® is placed. The carrier 19 can be executed in any way and Heise and with a. Drive (not shown) coupled, which puts the carrier 19 in rotation (arrow 20)!
    The carrier 12 is associated with a device for applying a device of a handling fluid, which comprises a nozzle 11, which is connected rigidly to a device 13 by means of a device 13. The actuators 12 allow the nozzle 11 of the applicator device to be moved, via the device 13, relative to the surface of the object to be treated, in the case of a semiconductor bar 8. The
    Move smog! icrrkei th in the direction X and. Direction · X are symbolized in Fig, I by arrows 5 and 6.
    The nozzle 11 becomes treatment fluid; In the case of the non-Haibieiter bafern, an Atzmehiurn is led over a pipe. The line 1.7 is disorderly a device i for Durchslussmengegegeiung, a: Kühlseinrichtq 7 and a device 2 for heating the liquid,
    The current location of the nozzle 11 · and thus the location 7 of rluesigreit sauft rages are detected by incremental encoder 1.4, which are associated with the actuators 12. The incremental encoders li output data relating to the current position of the t.ra.gd: uc.e 11 relatively only surface dee defers 8 to a control circuit 10,
    The line 17 for feeding rn Benandiunge 'liquid is unrnrcrernar before aex nozzle il associated with a temperature sensor 9, which outputs to the bevel circle 10 data concerning the temperature of the liquid detected by him. The temperature parameters IS sent to the control circuit: IQ by the temperature sensor 9 and those of the. Incremental encoders 14 delivered Posifciouspara.m.eter 15 are dom rule 10 as Regelaigcf ithmus the line 17 zugeoraneten Tonnurungen 4 for the Nchchmengenmengeregelung, the Ernrientung for Feeling 3 and the device · 2 to the heater; given up.
    In this way and in such a way, a highly dynamic position-coupled temperature-carrying and quantity control is possible, which is the Dorteil a thermal optimization of all med. 1 st e u n e T e il urniu s t
    The liquid supplied to the nozzle 11 in FIG. 1 for temperature and / or flow manipulation functions as a function of the side of the nozzle 11 of the thin-shelled article, in the example of the semiconductor wafer 8. Such is an improvement of the
    Surface roughness' bark; It cleans and, in the case of wet-chemical and temperature-dependent etching, for example on the wafer surface, it rinses.
    Especially advantageous; it is when in the context of the invention as means 2 sue heating a device is used, which operates on Xnduktimersbasis and the liquid flowing through the device 2 by convection ervarsit,
    A temperature sensor 9 which, with the device according to the invention, is exports of the method according to the invention, detecting the temperature of the treatment applied to the object, is explained below at Kana of FIGS. 2 and 3
    The temperature sensor 3 shown in FIGS. 2 and 3 permits rapid detection of the temperature of media, the gases, in particular cnesiologically highly reactive gases, being chemically reactive liquids or chemically highly reactive, flowing materials. The temperature sensor 9 is constructed so that the hieoieA.sf entering the body 39 from the hPfeii 31) is divided into two partial streams by a body 15 provided in the flow swg. A partial flow flows through a substantially straight channel 33 and a second partial flow through an angled channel comprising two sections: 34 and 35. The partial flow flowing through the fan arms 34 and 35 strikes an disc-shaped body 36 at an acute angle, for example 45 w, and then flows out through the section 35 out of the body 30 of the temperature sensor 9 (arrow 32 b).
    By dividing into the partial flows, eb.ne results in a reduction of the pressure in the region of the input to the temperature sensor 3.
    The disk-shaped: body 36 is from the top 3 of
    Temperature "sensor S is pressed by screws 38 and 33 over a lease 40 to a dicing belt 41 of the body 30 of the temperature sensor 3, resulting in a hermetically sealed system.
    The wetted parts of the temperature sensor 9 are preferably made of chemically resistant materials, neither, for example, the ScheibfbrmJ.ge body 36 corrngswerse from (golykristnilinem) diamond, glassy carbon, sapphire or silicon carbide, given fad. Is with CVD (Chemical Vapor Deposition) coating, which consists of sealants 304 from oil filters (.FF KM), and the core 30 of the temperature sensor 9, preferably from Pcdpetraf lurcäthyleh fPTFEi.
    The temperature is detected in the temperature sensor 9 via a temperature sensor 42, which is, for example, a platinum thin-resistance measuring resistor. The temperature sensor 42 is preferably adhesively bonded to the disc-shaped body 36 by means of a thermally conductive adhesive 13 (twee-complex epoxy resin) so that a good heat transfer is achieved. From the temperature sensor 42 lead away a line 46, which the com temperature sensor 42 detected data 16 inherited via the line shown in Fig. 1 to the control loop 1.0.
    Another version of a partial egg-jet sensor 9 is shown in FIG. 4 and will be described below.
    In this embodiment of a temperature sensor 9, turbulent extraneous forces are imposed by an obstacle 51 provided in the flow channel 11, which in the embodiment shown in FIG. 6 shows the temperature sensor sensor bus 9 a fast temperature exchange between disk 36 and: medium. As in the bus guide embodiment shown in Figs. 2 and 2a, the disc 3t is pressed by a lower part 37 of the temperature sensor while sealing a seal 4P to the buffing face 41 in the body 30 of the temperature sensor 9. The Ansführang: storm of a Tempereter sensor 9 shown as well as the Äosführungsferm 'of Fig. 2 and 2a allows a rapid Tempersturaasta / usch between flowing through the temperature sensor § media and the Temperat er · - sensor 42nd as indicated by the arrow S3. Temperature sensor 9 can also be repeatedly remanently formed. For this purpose, a plurality of temperature sensors 42 are glued to the disk tu sss temperature sensor 9, whose Temperatersignale by means of a verifungsprogramms (software algorithm) wercieig to possibly occurring tPmpera tdr a budcc hunger by Ai terser appearances to show attached to this Tempepaturunf ersch if there were some difference, do not go over ice, ice; exceed the minimum temperature difference becomes a cor. Verification system, slandered by a signal. One. Changing the temperature difference can be commented visually or acoustically. When multiple temperature fans 42 are placed on the disc 36, a multipolar cable 46 is used to route the data that the temperature probes 42 detect.
    An induction bäsisende device 2 rum warming sound through the line 17 to the nozzle 11 flowing liquid will be described below with reference to FIGS .. 5 to 8:
    The device shown in FIGS. 5 to 6: 2 for heating a liquid or gaseous, flowing medium has a hollow-tyl indifferent: heating element 60, which flows from the medium, which flows over connections 61, 62 and arrow 641, to The heating element 60, which for example is made of glassy carbon, is heated by alternating magnetic fields, in particular on its outside ("Sxin-Ef fek.t"} "The frequency of the magnetic field The magnetic field is generated by a coil 65. The coil 65 is separated by a tube 66, by the heating element 60 and by medium to be scanned. The transmission of energy thus takes place without contact. which is a considerable part of ago against körtmli just heating elements that need a elektric.en contact and thus against the tu eenanmerncer Me aium abäxehtei, means. The i :::: et. i. ci ut; s f i. s litti 11 e s sine η η s s chi s u cne s 6-8 hermetically dead ree ctor space 69 and via a density sys- tem with body 79, seal '71, clamping ring 72 and temperament! 73 abgefcrennt. The pressing member 73 is used for introducing Hess sensors 74, ρτ loo, PT 1060) and o i c ne r e 11 s "· s e n s o r e n '/ 3; B, TCO Termai Cut Off), since there is no longer any magnetic energy in the axial center, so uro sensors can be damaged due to strong electronomaguetic fields and a good nanowing. To provide better Oberwachnng of the heating element. This is advantageous for a safety-friendly operation.
    The sensomes 74 and 76 are preferably centered disorderly and embedded in thermally conductive agent 76, which depart from gen sensors v4, / 5 cables 77. An expanded nuncncnc so wxrq by means of a screw 73 on the body 70 vercross: and forms a hermetically lame area of the Keak. terra at 69 to the outer area,
    The device 2 is symmetrical with regard to its central plane, so that the same applies to the outlet 62 as to the inlet bi, outlet hi and inlet 61 may be provided with a screwdriver. To maintain the heating element SO on an even, uniform, concentric distance to the xenon gray Et and to be happy to hold the grooving ranch 66, a standoff 79 (Figures 10 and 11) is employed. A special proposal. Asr is a small distance, as there is a rapid Öäremubergarg from the heating element 60 on the medium., Which flows through the device 2 results. baserstromae medium is divided into an outer 80 and an inner flow area Bi, that the heating element 60 is completely umstrdmc.
    The siren 3 is designed to ensure that all components have a low thermal inertia. i '; : Fid-S, the device 2 is shown, wherein the coil 65, which preferably consists of a htaich copper tube, partially cut in Schrä.gansrcho dargestsllr is. Tilted is moderate. 8 also the inlet 02 for a cooling liquid and the outlet S3 for a E'ühif lüssigkeit with which the coil 60 is cooled-
    The described construction of the device 2 offers, furthermore, the possibility, in the field of influence, for example by diffusion of corrosive gases (t, S, eluent hydrogen), by sticks dead t, via a flush, ng to g 81 entrance and through the exit 85 again exit, wash away new. auszublassn.
    Cooling is done by Big. 9 explains:
    The inclined in Fig, 9 device 3 tum ton cool. liquid: media has two over each other and zusupp parallel aligned plates 90, the space between the plates. 90 is sealed by a seal 91. The seal 91 keeps the plates 90 spaced from each other. The distance between the plates 2 from each other is advantageously chosen so that a good heat transfer to the medium to be cooled is possible, which is supported by reaching a turbulent flows. The plates 90 may be made of sapphire, diamond, glassware, or silicon carbide, optionally with a Gi.iiziuPi ~ -Karfciä "vision (SiCb) deposited thereon: never flattened between a top 92 and a bottom 93 the device 3, which are zusammengehsirare by screws 94. A pipe section 95 is in a
    Ornnung the upper plate 92 screwed and aligned with a hole 9b in the upper plate 90 and is compared to the plate 30 by a ring seal {s, B, O-Eing) sealed.
    The pipe piece of PS serves as the inlet for the cooling medium (arrow 97). In the lower plate 2, a stirring piece 9b is also screwed in, which communicates with an opening PS in the lower plate and is sealed from the plate 90 by a ring sealing seal Ö · b · O-Ping). Through the pipe piece PS the medium, after having passed the space 90 through the plates 90, can emerge from the device 3 "Rieder {arrow Pb]. The plates are mutually earthed on both sides Peltieriemsnte 100 · that the medium estrogens warm over the The balding 101 each have an inlet 102 and an outlet 103, so that they can be traversed by a Khhl.medium.
    In Big, 9 iss still hinted .. that dis 1 '-'releaente be brought by heat-conductive adhesive 10s In good heat conducting connection · tu the heat sinks 101.
    The device tilted in the direction of Finn 3 can, after omniprene of the peiting elements 100, also cause heating of a device 3 flowing through the device 3. Medium be used.
    Sine establishment 4 curling liquidation is below on hand of. Fig. 10 explains:
    The device .4 cum regulating the flow of a medina: comprises a membrane 110 which has on one side a needle-like, protruding, protruding projection. Distance sum Venlisltr 111 which is integrally connected to a body 112 is, with the help of an adjusting device 113, 114 changes wefdan can. The adjusting device comprises vorrugsweiss a stepper motor 113 ', the spindle. 114 a drive for the membrane 110 darstel.it. The spindle 114 does not rotate and is moved linearly by means of a sleeve 113 inserted / rotating only. Media 115 has been introduced into the inlet 115 and exits via the outlet 116. The bodies 1X7 and IIS serve only to pose. the stepper motor 113 and now; From dense of the membrane 110 / for which not inclined glands are provided- Sin sensor 11S detects the distance of the diaphragm liü beer whose game before the valve seat 111, which data of the control are introduced.
    Sine in Figl 11 achem.ati.sch Dargestelite embodiment of the Durchfiussvaarbpnlation 1 determines the flow with the aid of a flow sensor 121 (for example, a DltraeC: Halldurc: hilcss --- Een5orI, The thereby recorded are fed via a Signulieitung 112 a controller 123 / which via another control line 121 the Aktor 113, 114 CSchrittmötori the Durehflusareglers 129 betreiht / in turn passes its current position by a Pcsiticnskontrolle a control line 125 aa the control, the flow of medium .: via inlet 127 and through outlet 128 can over a Hauptateuerleztung 126 men be specified externally.
    To permit rapid control of the temperature of the medium / relative to the position of the nozzle 11 relative to the wafer 8, tu, it is necessary to have a previously known temporal, local temperature. so that the required temperature of the medium can be maintained. For this purpose, a cooling device is advantageous. which compensates for localized temperature differentials while taking into account the current setting of the system and the medium being treated, in order to avoid any possible interference factors, heat sinks, etc. -
    The embodiment of an inventive device 130 shown in FIG. 12 is an extension of the device 1 according to FIG. 1. The device 130 also includes devices 134 for coning the temperature and devices d for. Controlling the rate of flow of the treatment medium (wetting agent) on the wafer 8 through the nozzle 11,
    In addition, according to Big, the device 1.30 comprises 12 devices, never reaching the concentration of the treatment code; In the dependency of the location: the nozzle 11 and thus of the location 7, in which treatment medium is applied to the wafer 8, can be changed,
    The device provided for this purpose comprises a sensor 133 which contains the concentrate ion. of the treatment medium. By way of example, the concentration sensor 133 is a common pH measuring device or a spectrometer with which the concentration of the particular treatment liquid used can be determined.
    More specifically, when adjusting the concentration in dependence on the nozzle 11, the device 130 operates as follows:
    The components of the treatment-Bledium be led via lines 137 and the defined concentration and tempeforgwerfe in Mebiumqusller 1 i2 passed via a control line 138 u to the Ablasserung / Regelnng 131, A software algorithm sets the supplied via the lines IBS temperature values, the over the line 140 supplied concentration values and the values of the temperature, which are detected by the temperature sensor 9, in control signals. This control signal is transmitted via control links 139 to the components 134 as a rule the temperature 134 and the device 1 for controlling the DurchfXussmenge »The media streams are fed to a Misehvorrichtung 132, which in particular as a static mixer, and mixed with each other, using a static Mischers a rapid mixing to reach the desired temperature and / or concentration at the given amount can be achieved hardly.
    The figures in Fig. 12 are of interest to the inverters 4, to the regulators irr the temperature 134 and to the media sources 136, which indicate that rehers may be provided as two of these components. Fig. 13 are various combinations of devices Other ways of combining the variants shown in FIG. 13 are the means 134 for adjusting the temperature by heating and cooling the medium are conceivable, including the variant without means for coning the temperature 134 at 141 is savored. If this variant, which is indicated at 141, is stimulated, the temperature settings can be divided analogously to those of the oil, the concentration being controlled by the flow regulator, without separate facilities for. Heating and cooling when the temperatures in the media sources 136 of the medium streams 13 sufficiently versed. are high,
    In the interests of relaxation, a description of the invention may be described as follows:
    When treating a half-length wafer 8, a treatment medium, in particular an etching or cleaning liquid, is applied from a nozzle 11 to the halide wafer 8. In this case, the temperature, the concentration, and / or the amount of medium applied in the time unit is regulated as a function of the location 7 in which the medium is applied to the semiconductor wafer 8. Thus, uniform treatment of the semiconductor wafer 8 is achieved because of unevenness in the. Semiconductor wafer 8 can be compensated.
    权利要求:
    Claims (28)
    [1]
    Claims 1. A method for treating articles (8) with a medium, in particular a liquid, characterized by the steps of applying the medium to the surface of the article (8) to be treated by means of an applicator (11) relative to the article regulating the properties of the medium to be applied to the object to be treated as a function of the position of the applicator (11) relative to the surface of the object (8) to be treated ,
    [2]
    2. The method according to claim 1, characterized in that the temperature of the applied to the object to be treated (8) medium is regulated.
    [3]
    3. The method according to claim 1 or 2, characterized in that the amount of in the unit of time to be applied to the object to be treated (8) medium is regulated.
    [4]
    4. The method according to any one of claims 1 to 3, characterized in that the concentration of the applied to the object to be treated (8) medium is regulated.
    [5]
    5. The method according to any one of claims 1 to 4, characterized in that a semiconductor wafer (8) is treated.
    [6]
    6. The method according to claim 5, characterized in that the semiconductor wafer (8) is etched.
    [7]
    7. The method according to claim 5, characterized in that the semiconductor wafer (8) is cleaned.
    [8]
    8. The method according to any one of claims 1 to 7, characterized in that the object to be treated (8) during the treatment in rotation (20) is added.
    [9]
    9. The method according to any one of claims 1 to 8, characterized in that the medium, in particular the liquid, from a nozzle (11) of a Aufbringingeeinrichtung on the object (8) is applied.
    [10]
    10. The method according to claim 9, characterized in that the application device, in particular its nozzle (11), relative to the object to be treated (8) by at least one actuator (12) is moved and that the position of the application device, in particular its nozzle (11 ), by incremental encoder (14) is detected.
    [11]
    11. The method according to any one of claims 1 to 10, characterized in that the temperature of the medium immediately before the application to the object to be treated (8), in particular immediately before its exit from the nozzle (10) of the applicator is detected.
    [12]
    12. The method according to claim 11, characterized in that the temperature by means of a temperature sensor (9), which is assigned to the application device, in particular the nozzle (11), is detected.
    [13]
    13. The method according to any one of claims 1 to 12, characterized in that the medium, in particular the liquid, is heated or cooled.
    [14]
    14. The method according to claim 13, characterized in that for controlling the temperature components of the applied to the object to be treated (8) medium, in particular the liquid having different temperatures from each other, are mixed.
    [15]
    15. The method according to any one of claims 1 to 14, characterized in that for controlling the concentration of the applied to 'the object to be treated medium, in particular the liquid having mutually different concentrations are mixed.
    [16]
    16. The method according to any one of claims 1 to 15, characterized in that the, in particular of incremental encoders (14) detected position of the applying device and, in particular from the temperature sensor (9) detected temperature of the medium are fed to a control circuit (10) and in that the regulating circuit (10) regulates the temperature of the medium, the amount of medium which is supplied to the applicator in the unit of time, and / or the concentration of the medium.
    [17]
    17. An apparatus for performing the method according to one of claims 1 to 16 with a holder (19) for the object to be treated (8), with means (11) for applying the medium to the object to be treated (8), to which Device comprising a conduit (13) for the medium, and having an actuator (12) for moving the applicator (11) relative to the object to be treated (8), characterized by at least one sensor for detecting at least one property of the medium, at least an incremental encoder (14) associated with the actuator for detecting the position of the applicator; a control circuit (10) operatively connected to the at least one sensor and the incremental encoder (14) and one of the conduit (13) for the actuator Medium associated device (4) for controlling the time unit through the line (13) flowing amount of medium, which means (4) to the control circuit (10) is operatively connected.
    [18]
    Device according to claim 17, characterized in that the support for the object to be treated is a carrier (19) for semiconductor wafers (8) ("chuck") having a drive for rotating (20). associated with the holder (19).
    [19]
    19. The apparatus of claim 17 or 18, characterized in that the application device comprises a nozzle (11) is applied from the medium to the surface to be treated of the article (8).
    [20]
    20. Device according to one of claims 17 to 19, characterized in that a sensor (9) is provided, which is assigned to the application device (11) at the point of exit of the medium from it and which detects the temperature of the medium.
    [21]
    21. Device according to one of claims 17 to 20, characterized in that the conduit for the medium means (2, 3) are associated for heating and cooling of the medium, which means are functionally connected to the control loop (10).
    [22]
    22. Device according to one of claims 17 to 21, characterized in that a sensor (133) for detecting the concentration of the medium, in particular the liquid ,, is provided.
    [23]
    23. Device according to one of claims 17 to 22, characterized in that a mixing device (132) for - - - »m m mixing partial streams of the medium, which partial streams have different temperatures and / or concentrations, is provided.
    [24]
    24. Device according to one of claims 17 to 23, characterized in that the means (2) for heating the medium, in particular the liquid, a convection-heating medium by means of the device, which operates on an induction basis.
    [25]
    25. Device according to one of claims 21 to 24, characterized in that the means (3) for cooling the medium comprises at least one Peltier element (100).
    [26]
    26. Temperature Sen sor, in particular for use in carrying out the method according to any one of claims 1 to 16 or in the device according to one of claims 17 to 25, characterized by a housing (30) in which a flow channel (33, 34, 35) is provided for the medium whose temperature is to be detected, that the flow channel (33) in the region of a temperature sensor in two sub-channels (34, 35) is divided, which after flowing past the temperature sensor ( 42) and that the temperature sensor (42) is arranged on a disk-shaped body (36) in heat-conducting contact.
    [27]
    27. Temperature sensor, in particular for use in carrying out the method according to one of claims 1 to 16 or in the device according to one of claims 17 to 25, characterized in that in the flow channel of the temperature sensor turbulence in the medium flowing through generating Obstacle (51) is provided, wherein the obstacle (51), based on the flow direction of the medium, after the disc (36) on which the temperature sensor (42) is arranged, is provided.
    [28]
    28. Flow control, in particular for use in carrying out the method according to one of claims 1 to 16 or in the device according to one of claims 17 to 25, characterized by a membrane (110) from which a projection in the direction of a valve seat (111 ) and by an actuator (113) for moving the projection of the diaphragm (110) relative to the valve seat (111).
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    法律状态:
    2021-08-15| HA| Change or addition of new inventor|Inventor name: JOERG HOFER-MOSER, AT Effective date: 20210630 Inventor name: MANUEL LINDER, AT Effective date: 20210630 Inventor name: KLAUS SMOLINER, AT Effective date: 20210630 |
    优先权:
    申请号 | 申请日 | 专利标题
    ATA946/2013A|AT515147B1|2013-12-09|2013-12-09|Method and device for treating objects with a liquid|ATA946/2013A| AT515147B1|2013-12-09|2013-12-09|Method and device for treating objects with a liquid|
    US15/103,025| US20160307770A1|2013-12-09|2014-11-26|Method and device for treating objects with a liquid|
    PCT/AT2014/000209| WO2015085334A1|2013-12-09|2014-11-26|Method and device for treating objects with a liquid|
    JP2016539041A| JP6195673B2|2013-12-09|2014-11-26|Method and apparatus for treating an object with a liquid|
    EP14830366.2A| EP3080837A1|2013-12-09|2014-11-26|Method and device for treating objects with a liquid|
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